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Trenz Electronic GmbH
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Item number VAR-827001460
Manufacturer Product Number: ATS-X50170P-C1-R0
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 20 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 32.27
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Content
1 piece
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Item ID | 101238 |
Condition | New |
Legacy item ID | 3432 |
Model | ATS-X50170P-C1-R0 |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 800 g |
Net weight | 800 g |
Customs tariff number | 84718090 |
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MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
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* Excl. VAT
excl.
Shipping
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* Excl. VAT
excl.
Shipping