Product Description
The ACU2CG/3EG/4EV/5EV System-on-Module (SoM) combines high-end AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device with fast DDR4 SDRAM, eMMC Flash, parallel Quad-SPI Flash and thus forms a complete and powerful embedded processing system.
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing
Key Features
- ● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
◆ ARM® quad-core Cortex™-A53
(Dual-core Arm Cortex-A53 for ACU2CG)
◆ ARM® dual-core Cortex™-R5F
◆ Mali-400 MP2 GPU (only for ZU3/4/5)
◆ H.264 / H.265 Video Codec (only for EV devices)
◆ 16nm FinFET+ FPGA fabric● Pluggable module with 4 x Panasonic board-to-board connectors
● 4 GByte (64-bit) DDR4 SDRAM on PS (2 GByte for ACU2CG)
● 1 GByte (16-bit) DDR4 SDRAM on PL (only for ZU3/4/5)
● 32 MB QSPI Flash
● 32 GB eMMC Flash (8 GB for ACU2CG) - ● PCIe® Gen3 ×4 (PL, only for ZU4/5), PCIe® Gen2 ×4 (PS)
● Gigabit transceivers
◆ 4 x PS-GTR, up to 6 Gbps
◆ 4 x PL GTH, up to 12.5 Gbps (only for ZU4/5)● User I/Os
◆ 54 PS MIOs
◆ 180 FPGA I/Os (84 HD + 96 HP)● Work temperature range of -40°C to +85°C (only for ZU3/4/5)
● 12V single supply
● Dimensions: 80 x 60 mm form factor
Module Features
Featuring the AMD/Xilinx Zynq™ UltraScale+™ MPSoC XCZU3EG-1SFVC784I
* If you want to design a base board based on this Zynq™ UltraScale+™ MPSoC System-on-Module, you need to purchase AXK6A2337YG high-speed Board to Board Connectors, 120 Pins, you also need to purchase FAN8060 Heatsink Kit, the FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
* We have Zynq™ UltraScale+™ MPSoC development boards AXU3EGB that uses this Zynq™ UltraScale+™ MPSoC module, to get started with development straight out of the box.
Please check the Relevant Products at the bottom of the page and click to learn more details.
Module Architecture
Click on the image to view a larger image.
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor's datasheets.
ALINX provides product user manuals for each product.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU3EG System-on-Module/SOM
| MPSoC SoM | 1 |
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