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UltraSOM+ MPSoC Module with AMD Zynq UltraScale+ ZU6EG-1E, 4 GByte DDR4, LP (TE0808-05-6BE81-F)

Low Profile Terminal/Socket Strips (1 mm), AMD Zynq UltraScale+ ZU6EG-1FFVC900E, 4 GByte DDR4, 128 MByte SPI Flash, 20 x serial high speed transceiver, size: 5.2 x 7.6 cm


Référence de l’article: VAR-827003714

Numéro de produit du fabricant: TE0808-05-6BE81-F

Code douane: 84718000


Disponible pour expédition immédiate: 0

Délais d'exécution 3 jours. Pour les commandes d'une valeur totale nette inférieure à 70 euros, nous facturerons des frais de traitement de 20 euros.

Article situé / expédié de : Riedlingen, Allemagne


1 034,28 USD *
Contenu 1 pièce



* Hors TVA hors Frais de livraison


This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

The predecessor of this article is TE0808-05-6BE21-F. All changes are in the Product Change Notification (PCN).

This module is identical to variant TE0808-05-6BE81-E except thelower 1 mm Samtec connectors.

Note: Due to the new revision the height profile of the module has changed.
Using TE0808-05 board as a replacement or in system(s) designed for TE0808-04, a review and adaption of mechanics e.g. cooling solutions must be implemented.
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This module will not be discontinued, but we recommend the TE0818 module series with an improved connector for new projects.

The Trenz Electronic TE0808-05-6BE81-F is a MPSoC module integrating a AMD Zynq UltraScale+ ZU6EG,4 GByteDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 xserial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0C to +85C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD Zynq UltraScale+ ZU6EG-1FFVC900E
    • Speedgrade: -1
    • Temperature range:Extended
    • Package: FFVC900
    • Grafikprozessor-Unit (GPU)
  • RAM / Storage
    • 4GByte DDR4 SDRAM
    • 2 x 64MByte SPI Boot Flash (dual parallel)
    • 2 Kbit serial EEPROMwith EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4 x160 pin B2B connectors (ST5)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • 16PL GTH
      • I2C, JTAG, CONFIG
    • 2 Transceiver clocks
    • PLL Clock Generator
    • LP, FP, PL separately controlled power domains
  • Power
    • 3.3 V power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-6BE81-F Trenz Electronic MPSoC module with AMD Zynq UltraScale+ZU6EG, low profile

Additional Information

All modules produced by Trenz Electronicare developed and manufactured in Germany.

Caractéristique technique Valeur
ID de l’art. 103228
État
ID de l'ancien article 01967b9ef9a27223b52bea97bf249099
Modèle TE0808-05-6BE81-F
Fabricant
Pays de fabrication Allemagne
Contenu 1 pièce
Poids 104 g