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MPSoC Module with AMD Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, low profile (TE0821-02-3BE81ML)
Low Profile connectors (2.5 mm), AMD Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte Flash, 8 GByte e.MMC, pin-compatible with TE0820, size: 4 x 5 cm
Référence de l’article: VAR-827003579
Numéro de produit du fabricant: TE0821-02-3BE81ML
Code douane: 84718000
Article situé / expédié de : Riedlingen, Allemagne
Please ask for any minimum quantities.
The predecessor of this article is TE0821-01-3BE21ML. All changes are in the Product Change Notification (PCN).
Important: Information for all serial numbers greater than 867995.
This module is identical to variant TE0821-02-3BE81MA except the lower 2.5 mm Samtec connectors.
The Trenz Electronic TE0821-02-3BE81ML is an industrial-grade MPSoC module with low profile board to board connectors integrating a AMD Zynq UltraScale+ ZU3EG,2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.
This module is pin compatible with Trenz Electronic TE0820 MPSoC modules(JM2 pin 100 is not connected).
All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.
All parts are at least extended temperature range of 0C to +85C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
- SoC / FPGA
- Device: AMD Zynq UltraScale+ XCZU3EG-1SFVC784E
- Speedgrade: -1
- Temperature range:Extended
- Package: SFVC784
- RAM / Storage
- 2GByte DDR4 SDRAM
- 2 x 64MByte SPI Boot Flash (dual parallel)
- 8GByte e.MMC memory
- 2 KbitMAC Adress serial EEPROMwith EUI-48 Node Identity
- On Board
- Lattice MachXO2 CPLD
- Programmable Quad Clock Generator
- Hi-speed USB2 ULPI Transceiver
- 4 x LEDs
- Interface
- 1 Gbps RGMII Ethernet interface
- Hi-speed USB2 ULPI transceiver with full OTG support
- 34 x High Performance (HP) und 96 x High Density PL I/Os
- 4 x serial PS GTR transceivers
- PCI Express interface
- SATA 3.1 interface
DisplayPort interface with video resolution up to 4k x 2k
2 x USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
- Power
- All power regulators on board
- Dimension
- 4x5 cm
- 4x5 cm
Other assembly options for cost or performance optimization plus high volume prices available on request.
Recommended Software
Vivado Standard Edition (free version)
The Vivado StandardEdition is the FREE version of the Vivado design suite.VivadoStandard delivers instant access to some basic Vivado features and functionality at no cost.
Overview Vivado Standard and Enterprise EditionDevelopment Support
There are different base boards available for this module.
Latest documentation, design support files and reference designs with source files are available for download free of charge.
Scope of Delivery
- 1 x TE0821-02-3BE81ML Trenz Electronic MPSoC modulewithAMD Zynq UltraScale+ ZU3EG and low profile Samtec connectors
Additional Information
- Manufacturer's article number: TE0821-02-3BE81ML
- Trenz Electronic TE0821 Wiki
- Samtec LSHM Razor Beam, High-Speed Hermaphroditic Terminal/Socket Strips, low profile 2.5 mm,
information concerning mating heights: Wiki, mounted on every 4 x 5 cm module from us marked with"LP" or "low profile". - Support Forum
All modules produced by Trenz Electronicare developed and manufactured in Germany.
| Caractéristique technique | Valeur |
|---|---|
| ID de l’art. | 103093 |
| État | |
| ID de l'ancien article | 01967b9f3bdc70f398ca8df84fa87347 |
| Modèle | TE0821-02-3BE81ML |
| Fabricant | |
| Pays de fabrication | Allemagne |
| Contenu | 1 pièce |
| Poids | 92 g |
