Trenz Electronic GmbH
MPSoC Module with AMD Zynq UltraScale+ ZU4EV-1E, 4 GB DDR4, 5.2 x 7.6 cm, LP (TE0803-04-4DE81-L)
Low profile connectors (1 mm), AMD Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
| Ceres::Template.singleItemTechnicalDataAttribute | Ceres::Template.singleItemTechnicalDataValue |
|---|---|
| ID articolo | 103116 |
| Condizione | |
| Modello | TE0803-04-4DE81-L |
| Produttore | Trenz Electronic GmbH |
| Paese di produzione | |
| Numero della tariffa doganale | 84718000 |
Numero di variazione (MEPA): VAR-827003602
Codice produttore: TE0803-04-4DE81-L
Codice doganale: 84718000
Articolo situato in e spedito da: Riedlingen, Germania
Please ask for any minimum quantities.
The predecessor of this article is TE0803-04-4DE21-L. All changes are in the Product Change Notification (PCN).
Note: Product modification for modules with a serial number greater than 732326. Product Change Notification (PCN).
This module is not recommended for new designs. Please use the TE0813 module series instead.
This module is identical to variant TE0803-04-4DE11-A except for the lower 1 mm Samtec connectors and the 4 GByte DDR4 SDRAM.
The Trenz Electronic TE0803-04-4DE81-L is an industrial-grade MPSoC module integrating a AMD Zynq UltraScale+ with ZU4EV,4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.
All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.
All parts are at least extended temperature range of 0C to +85C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
- AMDZynq UltraScale+ XCZU4EV-1SFVC784E
- ZU4EV, 784 Pin Packages
- Dimensions: 5.2 x 7.6 cm
- Plug-on module with 4 x 160 pin B2B connectors (low profile, 1 mm)
- 3 mm mounting holes for skyline heat spreader
- Rugged for shock and high vibration
- 4GByte (64-bit) widthDDR4 SDRAM
- 128 MByte QSPI Boot Flash dual parallel
- 2 Kbit Serial EEPROM for MAC Address
- 48 High-density (HD) I/O's (2 banks)
- Graphic Processing Unit (GPU) + Video codec unit (VCU)
- User I/O
- 65 x multi-use I/O's (MIO)
- 156 high-performance (HP) I/O's (3 banks)
- Serial transceiver: 4 x PS-GTR, 4 x PL-GTH
- Programmable 4-channelPLL clock generator
- All power supplies on board, single 3.3V power source required
- Evenly spread supply pins for good signal integrity
Other assembly options for cost or performance optimization plus high volume prices available on request.
Recommended Software
Vivado Standard Edition (free version)
The Vivado StandardEdition is the FREE version of the Vivado design suite.VivadoStandard delivers instant access to some basic Vivado features and functionality at no cost.
Overview Vivado Standard and Enterprise EditionDevelopment Support
There is a base board available for this module.
Latest documentation, design support files and reference designs with source files are available for download free of charge.
Scope of Delivery
- 1 x TE0803-04-4DE81-L Trenz Electronic MPSoC module with AMD Zynq UltraScale+ ZU4EV, low profile
Additional Information
- Manufacturer's article number: TE0803-04-4DE81-L
- Trenz Electronic TE0803 Wiki
- Support Forum
All modules produced by Trenz Electronicare developed and manufactured in Germany.
The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.
| Ceres::Template.singleItemTechnicalDataAttribute | Ceres::Template.singleItemTechnicalDataValue |
|---|---|
| ID articolo | 103116 |
| Condizione | |
| ID della variazione | 01967b9eebaf7137a9f945beb0a0bbd9 |
| Modello | TE0803-04-4DE81-L |
| Produttore | Trenz Electronic GmbH |
| Paese di produzione | |
| Contenuto | 1 undefined |
| Peso | 101 g |
