FPGA Module with AMD Spartan 6 LX45-2I, 512 MByte DDR3L, Mini-USB 2.0, 4 x 5 cm (TE0630-03-52I22-A)

AMD Spartan 6 XC6SLX45-2CSG484I, mini-USB 2.0 high-speed device, 512 MByte DDR3L SDRAM, 8 MByte QSPI Flash memory


Ceres::Template.singleItemTechnicalDataAttribute Ceres::Template.singleItemTechnicalDataValue
ID articolo 102980
Condizione
Modello TE0630-03-52I22-A
Produttore
Paese di produzione
Numero della tariffa doganale 84718000

Numero di variazione (MEPA): VAR-827003466

Codice produttore: TE0630-03-52I22-A

Codice doganale: 84718000


Disponibile per la spedizione immediata: 0

Tempo di elaborazione 3 giorni. Per gli ordini con un valore netto totale inferiore a 70 euro, verrà applicata una tassa di elaborazione di 20 euro.

Articolo situato in e spedito da: Riedlingen, Germania


215,35 USD *
Contenuto 1
Effettua il login e ottieni prezzi migliori. Oppure contattateci e richiedete lo stato B2B..



* IVA Excl. escl. Costi di spedizione


This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

The predecessor of this article is TE0630-02I. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TE0630 is an industrial-grade FPGA micromodule integrating a AMD Spartan 6 FPGA, a mini-USB 2.0 device port,4 GBit (512MByte) DDR3L SDRAM with 16-Bit width, 8 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's are provided via rugged high-speed stacking connectors. The TE0630 is fully mechanically and largely electrically backward compatible with Trenz Electronic TE0300 AMD Spartan 3E FPGA micromodules.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40C to +85C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD Spartan 6 XC6SLX45-2CSG484I
    • Speedgrade: -2
    • Temperature range: industrial-grade
    • Package: CSG484
  • RAM / Storage
    • 16-Bit breiter4 GBit (512MByte) DDR3L SDRAM
    • 64 Mbit (8 Mbyte) QSPI Flash memory (for configuration and operation) accessible through:
      • FPGA
      • JTAG port (SPI indirekt)
      • USB
  • On Board
    • 24 MHz and 100 MHz reference clock signals
    • eFUSE bit-stream encryption (LX75 or larger)
    • 4user LEDs
    • 1 user push-button
    • 2 user DIP switches
  • Interface
    • Plug-on module with 2 80 pin stacking connectors
    • Up to 40 differential and up to 109 single-ended FPGA I/O's pins available on B2B connectors
    • FPGA configuration through:
      • B2B connector
      • JTAG port
      • SPI Flash memory
  • Power
    • 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails
  • Dimension
    • 4x5 cm

Product specification

  • AMD Spartan 6 LX FPGA: XC6SLX45-2CSG484I = 43 k logic cells, industrial grade
  • Cypress CY7C68013A-56LFXC EZ-USB FX2LP: USB microcontroller, high speed USB peripheral controller
  • 16-Bit-wide (data-bus)4 Gigabit (512 Megabyte) DDR3L SDRAM
  • 64 MBit (8 MByte) serial Flash memory with dual/quad QSPI interface
  • 2 x fine-pitch (0.5 mm) 80-pin board-to-board connectors Hirose DF17 series
  • Up to 40 differential FPGA input/output pins available on B2B connectors
  • Up to 109 single-ended FPGA input/output pins available on B2B connectors
  • USB and JTAG pins available on B2B connectors
  • 4.0 A high-efficiency DC-DC switching regulator for power rail 1.2 V
  • 3.0 A high-efficiency DC-DC switching regulator for power rail 1.5 V
  • 0.8 A DC-DC linear regulator for power rails 2.5 V and VCCAUX
  • 3.0 A high-efficiency DC-DC switching regulator for power rail 3.3 V
  • Power supervisory circuits with power-fail
  • Power supply voltage range: 4.0 to 5.5 V
  • Power supply source: USB port, board-to-board interconnect (e.g. carrier board)
  • Dimensions: 47.5 40.5 mm (19.2 cm2)
  • Minimum height: TBD (without connectors)
  • Minimum height on carrier board: TBD
  • Weight: 14.0 to 14.5 g
  • Temperature grades
    • commercial (C-type FPGA device)
    • industrial (I-type FPGA device)

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

for Trenz Electronicmodules with Spartan 3A, -3Eand Spartan 6LX45/LX75

ISE Design Suite: WebPACK Edition

ISE WebPACK delivers a complete, front-to-back design flow providing instant access to the ISE features and functionality at no cost.

https://www.xilinx.com/products/design-tools/ise-design-suite/ise-webpack.html

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 xTE0630-03-52I22-A Trenz Electronic FPGAmodule with AMD Spartan 6 LX45FPGA

Additional Information

All modules produced by Trenz Electronicare developed and manufactured in Germany.

Ceres::Template.singleItemTechnicalDataAttribute Ceres::Template.singleItemTechnicalDataValue
ID articolo 102980
Condizione
ID della variazione 0196862ec9047347af1ae3dcae5ce086
Modello TE0630-03-52I22-A
Produttore
Paese di produzione
Contenuto 1 undefined
Peso 81 g