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The Trenz Electronic Starter Kit TE0817-02-7DE81-AS consists of a TE0817-02-7DE81-A module with ZU7EV on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure,two mountedXMOD FTDI JTAG Adapter, an32 GB micro SD card, an USB cable, a power cable and screws.

The Module: TE0817-02-7DE81-A

The Trenz Electronic TE0817-02-7DE81-A is a powerful MPSoC module integrating a AMD Zynq UltraScale+ ZU7EV,4 GByteDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • SoC / FPGA
    • Device: AMD Zynq UltraScale+ XCZU7EV-1FBVB900E
    • Speedgrade: -1
    • Temperature range: Extended
    • Package: FBVB900E
    • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • RAM / Storage
    • 4GByte DDR4 SDRAM
    • 2 x 64MByte QSPI Boot Flash
    • 2 KbitMAC Adress serial EEPROMwith EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4x B2B Connector (ADM6)
      • up to 204 PL IO
        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • Power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

The Base Board: TEBF0818-02A

The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081xMPSoC series.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 xMicrochip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' IC interfaces muxed to MPSoC's IC interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 64 GBit (8 GByte) on-board eMMC Flash
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and IC interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm 170 mm.Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2 x USB3 Host
  • Displayport
  • microSD
  • Two LEDs
  • CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Enclosure - Technical Features

  • Dimensions: 260 x 276 x 316 mm (B x H x T)
  • Material: Steel
  • Colour: Black
  • Drive Slots: 2 x 3.5 inch (intern, 3.5 inch) and 2 x 2.5 inch (intern, 2.5 inch)
  • Expansion slots: 2
  • I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
  • Maximum graphic card lenght: 255 mm (inner enclosure)
  • Maximum graphic card lenght: 285 mm (outer enclosure)
  • Maximum CPU cooler height: 140 mm
  • Maximum lenght power supply: 200 mm

Scope of Delivery - Starter Kit

  • 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
  • 1 x Power supply Be quiet! BN292 Be Quiet! Pure Power 11, 400W, 80 PLUS (with fan)
  • 1 x TE0817-02-7DE81-A MPSoC module with AMD Zynq UltraScale+ ZU7EV
  • 1 x TEBF0818-02A base board
  • 1 xHeatsink SuperGrip ATS-X50310P-C1-R031 x 31 x 17,5 mm (Article no. 29664)
  • 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
  • 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
  • 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
  • 1 x USB cable, Type A to Type B Mini, 2 meter length
  • 1 x power cable Schuko 1.8m black
  • 4x Phillips screws, M3 x 6, pan head, zinc coated

Additional Information

All modules produced by Trenz Electronicare developed and manufactured in Germany.

Ceres::Template.singleItemTechnicalDataAttribute Ceres::Template.singleItemTechnicalDataValue
Identificación de artículo 103206
Estado
ID de artículo histórico 01967b9f13eb7343a8067cfc7ea6a5bb
Modelo TE0817-02-7DE81-AS
Fabricante Trenz Electronic GmbH
País de origen
Contenido 1 undefined
Peso 6300 g


Trenz Electronic GmbH

Starter Kit with AMD Zynq UltraScale+ ZU7EV-1E MPSoC module (TE0817-02-7DE81-AS)

MPSoC module TE0817 with pre-assembled heat sink on a TEBF0818 carrier board in a Core Mini-ITX case, accessories included.


Código de artículo VAR-827003692

Número de pieza del fabricante: TE0817-02-7DE81-AS

Código aduanero: 84715000

Nivel del stock: ${ $store.getters.currentItemVariation.stock.net }

Tiempo de tramitación: 3 días. Para pedidos con un valor neto total inferior a 70 euros, cobraremos unos gastos de tramitación de 20 euros.

El producto se envía desde Riedlingen, Alemania.


2.049,00 EUR *
Contenido 1



* Sin IVA excl. Gastos de envío

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