Features

Designed for 31 x 31 mm components
Requires minimal space around the components perimeter, ideal for densely populated PCBs
Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs
Eliminates the need to drill mounting holes in the PCB

Thermal Performance

Dimension A: 31.00 mm

Dimension B: 31.00 mm

Dimension C: 17.50 mm

Dimension D: 54.9 mm

TIM: T766

Finish: Blue-Anodized

Dimension A and B refer to component size
Dimension C is the heat sink height from the bottom of the base to the top of the fin field
Thermal performance data are provided for reference only. Actual performance may vary by
application
ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant

Ceres::Template.singleItemTechnicalDataAttribute	Ceres::Template.singleItemTechnicalDataValue
Identificación de artículo	103031
Estado
ID de artículo histórico	01967b9ed17f732c9216033d9258441d
Modelo	29664
Fabricante	Trenz Electronic GmbH
País de origen
Contenido	1 undefined
Peso	50 g