ALINX AMD Xilinx Zynq UltraScale+ MPSoC XCZU2CG SoM system-on-module M2CG ZU2CG

Product Description

The M2CG/3EG/4EV/5EV System-on-Module (SoM) combines high-end AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device with fast DDR4 SDRAM, eMMC Flash, parallel Quad-SPI Flash and thus forms a complete and powerful embedded processing system.

Applications

● Artificial Intelligence
● AV Broadcasting
● Industrial Internet of Thing
● Digital Signal Processing
● Drive / Motion Control
● Machine Vision
● Medical Endoscop
● Video and Image Processing

Key Features

● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
◆ ARM® quad-core Cortex™-A53
(Dual-core Arm Cortex-A53 for ACU2CG)
◆ ARM® dual-core Cortex™-R5F
◆ Mali-400 MP2 GPU (only for ZU3/4/5)
◆ H.264 / H.265 Video Codec (only for EV devices)
◆ 16nm FinFET+ FPGA fabric● Castellated-hole form factor
● 4 GByte (64-bit) DDR4 SDRAM on PS
● 32 MB QSPI Flash
● 8 GB eMMC Flash
● PCIe® Gen2 ×1 (PS)
● User I/Os
◆ 5 PS MIOs
◆ 102 FPGA I/Os (6 HD + 96 HP)● Work temperature range of 0℃~70℃
● 12V single supply
● Dimensions: 70 x 50 mm form factor

Ceres::Template.singleItemTechnicalDataAttribute	Ceres::Template.singleItemTechnicalDataValue
Identificación de artículo	102446
Estado
Modelo	M2CG
Fabricante	Alinx Electronic Limited
País de origen
Contenido	1 undefined
Peso	1000 g
Peso neto	1000 g

Module Features

Featuring the AMD/Xilinx Zynq™ UltraScale+™ MPSoC XCZU2CG-1SFVC784E

* If you want to design a base board based on this Zynq™ UltraScale+™ MPSoC System-on-Module, you need to purchase FAN8060 Heatsink Kit, the FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.