Product Description
The AX7350B SoC development board equipped with the AMD/Xilinx Zynq™ 7000 SoC-series XC7Z035 device, delivers standout performance with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, SFP+, FMC LPC, Gigabit Ethernet.
Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (SFP+).
Applications
Automotive
● Road Sign Recognition
● ADAS
● Smart Transportation
Communication Network
● Ethernet Backhaul
● Small Cell Baseband
● Network Switch
● Flexible radio platform
Industrial
● Motor control
● Industrial Control
● Industrial IoT
● Instrumentation
● Smart Grid
Video and Image Processing
● Professional Cameras
● Computer Vision
● Machine Vision
Medical
● Endoscop
● Ultrasound, CT, MRI
Key Features
- ● AMD/Xilinx Zynq™ 7000 SoC:
◆ ARM® dual-core Cortex™-A9 up to 800 MHz
◆ Xilinx Kintex 7 28nm FPGA fabric● 1 GByte (32-bit) DDR3 SDRAM on PS
● 1 GByte (32-bit) DDR3 SDRAM on PL
● 32 MB QSPI Flash
● 8 GB eMMC Flash
● 1 x FMC LPC (FMC has 34 pairs lvds io and 1 pairs GTX)
● 1 x HDMI out
● 2 x SFP+ (per line 10Gbps)
● 2 x Gigabit Ethernet (1 x PS + 1 x PL) - ● 4 x USB2.0 (Host)
● 1 x USB to UART on PS
● 1 x PCIe® Gen2 ×4 (PL)
● 1 x JTAG
● 1 x Micro SD
● LED (1 x PWR + 1 x DONE + 1 x RxD + 1 x TxD + PS LED + 4 x PL LED)
● KEY (1 x PS RST + 1 x PS KEY + 4 x PS KEY)
● 12V single supply
● Dimensions: 220 x 125 mm form factor
| Ceres::Template.singleItemTechnicalDataAttribute | Ceres::Template.singleItemTechnicalDataValue |
|---|---|
| Identificación de artículo | 102413 |
| Estado | |
| Modelo | AX7350B V2.0 |
| Fabricante | Alinx Electronic Limited |
| País de origen | |
| Contenido | 1 undefined |
| Peso | 1500 g |
| Peso neto | 1300 g |
Board Features
Featuring the AMD/Xilinx Zynq™ 7000 SoC XC7Z035-2FFG676I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ 7000 SoC based application.
What's Inside the Box
ALINX AMD Xilinx Zynq™ 7000 SoC XC7Z035 development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA and SoC devices – it is low-profile and covers the whole XC7Z035 device surface.
| Development Board | 1 | Heatsink Kit (preinstalled) | 1 |
|---|---|---|---|
| Mini USB Cable | 2 | Transparent protective board | 1 |
| 12V Power Adapter | 1 | Card Reader | 1 |
| TF Card | 1 |
Alinx Electronic Limited
Alinx AX7350B Dev Board & Kit with AMD Zynq 7000 SoC XC7Z035
The AX7350B SoC development board equipped with the AMD Zynq™ 7000 SoC-series device with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, SFP+, FMC LPC, Gigabit Ethernet, suitable for Industrial, Medical, Automotive, Video and Image Processing, Control & Instrumentation and Communication, etc.
Código de artículo VAR-827002853
Número de pieza del fabricante: AX7350B V2.0
Código aduanero: 8471800000
El producto se envía desde Riedlingen, Alemania.
Los clientes suelen ver
También te puede interesar
