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ZedBoard Zynq-7000 ARM/FPGA SoC Development Board Add SDSoC Voucher
USD 677.73 *
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Trenz Electronic GmbH
UltraSOM+ MPSoC Module with Zynq™ UltraScale+™ ZU9EG-2I, 4 GByte DDR4(TE0818-02-9GI81-A)
AMD/Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GByte DDR4, 128 MByte SPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm
Item number VAR-827002589
Manufacturer Product Number: TE0818-02-9GI81-A
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
USD 1,646.73
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Content
1 piece
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Item ID | 102190 |
Condition | New |
Legacy item ID | 3805 |
Model | TE0818-02-9GI81-A |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 72 g |
Net weight | 72 g |
Customs tariff number | 84718090 |
ZedBoard Zynq-7000 ARM/FPGA SoC Development Board Add SDSoC Voucher
USD 677.73 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.62 *
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BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.62 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.62 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.62 *
* Excl. VAT
excl.
Shipping