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BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.89 *
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RUT950 (Global) + SDK + One free RMS credit, Cellular network region: Global
USD 0.00 *
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FPGA Module with Xilinx Artix-7 XC7A100T-1FGG484I, 1 GByte DDR3, 4 x 5 cm
USD 281.31 *
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Trenz Electronic GmbH
MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm(TE0813-02-5DE81-A)
AMD/Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm
Item number VAR-827002629
Manufacturer Product Number: TE0813-02-5DE81-A
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
USD 1,290.13
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Content
1 piece
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Item ID | 102230 |
Condition | New |
Legacy item ID | 3775 |
Model | TE0813-02-5DE81-A |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 800 g |
Net weight | 800 g |
Customs tariff number | 84718090 |
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.89 *
* Excl. VAT
excl.
Shipping
RUT950 (Global) + SDK + One free RMS credit, Cellular network region: Global
USD 0.00 *
* Excl. VAT
excl.
Shipping
FPGA Module with Xilinx Artix-7 XC7A100T-1FGG484I, 1 GByte DDR3, 4 x 5 cm
USD 281.31 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.89 *
* Excl. VAT
excl.
Shipping
RUT950 (Global) + SDK + One free RMS credit, Cellular network region: Global
USD 0.00 *
* Excl. VAT
excl.
Shipping
FPGA Module with Xilinx Artix-7 XC7A100T-1FGG484I, 1 GByte DDR3, 4 x 5 cm
USD 281.31 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.89 *
* Excl. VAT
excl.
Shipping
RUT950 (Global) + SDK + One free RMS credit, Cellular network region: Global
USD 0.00 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
USD 36.89 *
* Excl. VAT
excl.
Shipping
RUT950 (Global) + SDK + One free RMS credit, Cellular network region: Global
USD 0.00 *
* Excl. VAT
excl.
Shipping
FPGA Module with AMD Kintex™ 7 160T-2I, 32 MByte QSPI Flash, 4 x 5 cm(TE0741-05-B2I-1-A)
USD 978.84 *
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