Z19-M-ALINX-AMD-Xilinx-Zynq-UltraScale+-MPSoC-XCZU19EG-NVIDIA-Jetson-Orin-NX-module-FPGA-+-GPU-Heterogeneous-Computing-AI-Video-Image-Processing-Development-Development-Board-&-Kit-P.jpg

Product Description

Z19-M development board equipped with AMD/Xilinx Zynq ™ UltraScale+ MPSoC series XCZU19EG device + NVIDIA Jetson Orin NX module, FPGA + GPU heterogeneous computing video image processing development platform. Equipped with fast DDR4 SDRAM, eMMC flash memory and QSPI flash memory, it provides excellent performance, realizes AI edge computing, and professional high-definition 8K video image acquisition and processing.

Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (100G QSFP28+), high-speed storage (M.2) and video applications (DP, 12G-SDI, 8K HDMI2.1).

Applications

● Industrial Manufacturing
● Semiconductor Optical Testing
● Surgical Robot
● Medical Endoscope
● Collaborative Robots
● Intelligent Transportation and Electricity

Key Features

Zynq Ultrascale+ MPSoC System
● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz
◆ ARM® dual-core Cortex™-R5F up to 533 MHz
◆ Mali-400 MP2 GPU
◆ 16nm FinFET+ FPGA fabric
● 8 GByte (64-bit) DDR4 SDRAM on PS
● 16 GByte (64-bit) DDR4 SDRAM on PL
● 2 x 64 MB QSPI Flash
● 32 GB eMMC Flash
● 1 x NVIDIA Jetson Orin NX Modules Interface
● 4 x HDMI2.1 input + 4 x HDMI2.1 output (Support 8K/60Hz video)
● 8 x 12G SDI Interface (Supports 4K/60Hz video input or output)
● 2 x 100Gbps QSFP28 connectors
● 1 x Gigabit Ethernet on PS
● 1 x FMC HPC connectors (FMC has 36 pairs lvds io and 8 pairs GTH)
● 1 x UART
● 1 x JTAG
● 1 x Micro SD
● 1 x EEPROM + Temperature sensor (LM75)
● 1 x RTC (Real-time clock)
● 4 x LEDs
● 1 x power switch button
● 12V single supply
● Dimensions: 280 x 163 mm form factor
NVIDIA JETSON ORIN NX System
● NVIDIA Jetson Orin NX Modules:
◆ Jetson Orin NX 16GB: Up to 100 TOPs（Need to purchase separately）
◆ Jetson Orin NX 8GB: Up to 70 TOPs（Need to purchase separately）
( *Jetson Orin NX 16GB package and Jetson Orin NX 8GB package are offered separately. If you want to purchase them, please contact sales@alinx.com or sales.online@alinx.com to know more details.)
● 1 x DP
● 1 x Gigabit Ethernet
● 1 x M.2 SSD interface
● 1 x M.2 WIFI/BT interface
● 4 x USB3.0 Type-A
● 1 x USB3.0 Type-C
● 1 x EEPROM: 24AA04 I/SN, 4-Kbit

Caractéristique technique	Valeur
ID de l’art.	102684
État
Modèle	Z19-M V1.0
Fabricant	Alinx Electronic Limited
Pays de fabrication	Chine
Contenu	1 pièce
Poids	5000 g
Poids net	4000 g

Board Features

Featuring the AMD/Xilinx Zynq™ UltraScale+™ MPSoC XCZU19EG-2FFVC1760I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ MPSoC based application.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU19EG development board and Some accessories

The FAN8080 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC devices – it is low-profile and covers the whole XCZU19EG device surface.

Development Board	1	Heatsink Kit (preinstalled)	1
Mini USB Cable	1	USB Downloader Cable / set	1
12V Power Adapter	1	Acrylic Plate	1
TF Card	1	Card Reader	1