Product Description
The ACVU13 Core Board, featuring a Virtex UltraScale+™ FPGA（ XCVU13P） and high-speed DDR4, is engineered for high-performance data acceleration and network processing.
Applications
● Compute Acceleration
● Machine Learning and AI
● Network Acceleration
● Wired Communications
● 5G Baseband
● Radar
● Test and Measurement
● Emulation and Prototyping
Key Features
● AMD/Xilinx Virtex Ultrascale+™:
◆ 16nm FinFET FPGA fabric
◆ System Logic Cells 3,780K
◆ DSP Slices 12,288
◆ 32 Gigabit GTY, Power Optimized Transceiver
◆ Peak INT8 DSP 38.3TOP/s
◆ 150G Interlaken
◆ 100G Ethernet MAC/PCS● Pluggable module with 8 x Samtec board-to-board connectors● 20 GByte DDR4 SDRAM
● 256MB QSPI Flash
● PCIe® Gen3 ×16
● transceivers
◆ 76 x GTY, up to 28.21 Gbps● User I/Os
◆ 377 FPGA HP IO● Work temperature range of -40°C to +85°C
● 12V single supply
● Dimension: 106 x 106mm form factor
Module Features
Featuring the AMD/Xilinx Virtex Ultrascale+™ XCVU13P-2FHGB2104I
* If you want to design a base board based on this Kintex Ultrascale+™ FPGA System-on-Module, you need to purchase ADM6-60-01.5-L-4-2-A-TR high-speed Board to Board Connectors, 240 Pins, you also need to purchase Heatsink Kit, the Heatsink Kit is an optimal cooling solution for ALINX FPGA and modules – it is low-profile and covers the whole module surface.
* We have Virtex Ultrascale+™ development boards AXVU13G that uses this Virtex Ultrascale+™ module, to get started with development straight out of the box.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Virtex Ultrascale+™ XCVU13P FPGA System-on-Module/SoM
| Virtex Ultrascale+™ SoM | 1 |
|---|
