Starter Kit with AMD Zynq UltraScale+ ZU7EV-1E MPSoC module (TE0817-02-7DE81-AS)

MPSoC module TE0817 with pre-assembled heat sink on a TEBF0818 carrier board in a Core Mini-ITX case, accessories included.


Référence de l’article: VAR-827003692

Numéro de produit du fabricant: TE0817-02-7DE81-AS

Code douane: 84718000


Disponible pour expédition immédiate: 0

Délais d'exécution 3 jours. Pour les commandes d'une valeur totale nette inférieure à 70 euros, nous facturerons des frais de traitement de 20 euros.

Article situé / expédié de : Riedlingen, Allemagne


2 031,93 EUR *
Contenu 1 pièce



* Hors TVA hors Frais de livraison


This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

The Trenz Electronic Starter Kit TE0817-02-7DE81-AS consists of a TE0817-02-7DE81-A module with ZU7EV on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure,two mountedXMOD FTDI JTAG Adapter, an32 GB micro SD card, an USB cable, a power cable and screws.

The Module: TE0817-02-7DE81-A

The Trenz Electronic TE0817-02-7DE81-A is a powerful MPSoC module integrating a AMD Zynq UltraScale+ ZU7EV,4 GByteDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • SoC / FPGA
    • Device: AMD Zynq UltraScale+ XCZU7EV-1FBVB900E
    • Speedgrade: -1
    • Temperature range: Extended
    • Package: FBVB900E
    • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • RAM / Storage
    • 4GByte DDR4 SDRAM
    • 2 x 64MByte QSPI Boot Flash
    • 2 KbitMAC Adress serial EEPROMwith EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4x B2B Connector (ADM6)
      • up to 204 PL IO
        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • Power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

The Base Board: TEBF0818-02A

The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081xMPSoC series.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 xMicrochip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' IC interfaces muxed to MPSoC's IC interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 64 GBit (8 GByte) on-board eMMC Flash
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and IC interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm 170 mm.Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2 x USB3 Host
  • Displayport
  • microSD
  • Two LEDs
  • CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Enclosure - Technical Features

  • Dimensions: 260 x 276 x 316 mm (B x H x T)
  • Material: Steel
  • Colour: Black
  • Drive Slots: 2 x 3.5 inch (intern, 3.5 inch) and 2 x 2.5 inch (intern, 2.5 inch)
  • Expansion slots: 2
  • I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
  • Maximum graphic card lenght: 255 mm (inner enclosure)
  • Maximum graphic card lenght: 285 mm (outer enclosure)
  • Maximum CPU cooler height: 140 mm
  • Maximum lenght power supply: 200 mm

Scope of Delivery - Starter Kit

  • 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
  • 1 x Power supply Be quiet! BN292 Be Quiet! Pure Power 11, 400W, 80 PLUS (with fan)
  • 1 x TE0817-02-7DE81-A MPSoC module with AMD Zynq UltraScale+ ZU7EV
  • 1 x TEBF0818-02A base board
  • 1 xHeatsink SuperGrip ATS-X50310P-C1-R031 x 31 x 17,5 mm (Article no. 29664)
  • 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
  • 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
  • 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
  • 1 x USB cable, Type A to Type B Mini, 2 meter length
  • 1 x power cable Schuko 1.8m black
  • 4x Phillips screws, M3 x 6, pan head, zinc coated

Additional Information

All modules produced by Trenz Electronicare developed and manufactured in Germany.

Caractéristique technique Valeur
ID de l’art. 103206
État
ID de l'ancien article 01967b9f13eb7343a8067cfc7ea6a5bb
Modèle TE0817-02-7DE81-AS
Fabricant
Pays de fabrication Allemagne
Contenu 1 pièce
Poids 6300 g