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Starter Kit with AMD Zynq UltraScale+ ZU3EG-1E MPSoC module (TE0813-02-3BE81-AS)
MPSoC module TE0813 with pre-assembled heat sink on a TEBF0818 carrier board in a Core Mini-ITX case, accessories included.
Référence de l’article: VAR-827003691
Numéro de produit du fabricant: TE0813-02-3BE81-AS
Code douane: 84718000
Article situé / expédié de : Riedlingen, Allemagne
Please ask for any minimum quantities.
The predecessor of this article is TE0803-04-3BE11-AS. All changes are in the Product Change Notification (PCN).
The Trenz Electronic Starter Kit TE0813-02-3BE81-AS consists of a TE0813-02-3BE81-A module with ZU3EG on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure,two mountedXMOD FTDI JTAG Adapter, an32 GB micro SD card, an USB cable, a power cable and screws.
The Module: TE0813-02-3BE81-A
The Trenz Electronic TE0813-02-3BE81-A is an industrial-grade MPSoC module integrating a AMD Zynq UltraScale+ with ZU3EG,4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.
Key Features
- FPGA
- Device: AMD Zynq UltraScale+ XCZU3EG-1SFVC784E
- Speedgrade: -1
- Temperature range:Extended
- Package: SFVC784
- Grafikprozessor-Unit (GPU)
- RAM / Storage
- 4GByte DDR4 SDRAM
- 128 MByte QSPI Boot Flash
- 2 Kbit serial EEPROMwith EUI-48 Node Identity
- On Board
- Oscillator
- Programmable 4-channel PLL clock generator
- Interface
- Plug-on module with 4 x 240 pin B2B connectors (ADM6)
- 204 PL IO
- HP: 156
- HD: 48
65 PS MIO
- 4 PS GTR
- I2C, JTAG
- 204 PL IO
- Plug-on module with 4 x 240 pin B2B connectors (ADM6)
- Power
- 3.3V power supply required
- Dimension
- 5.2 x 7.6 cm
- 5.2 x 7.6 cm
Recommended Software
Vivado Standard Edition (free version)
The Vivado StandardEdition is the FREE version of the Vivado design suite.VivadoStandard delivers instant access to some basic Vivado features and functionality at no cost.
Overview Vivado Standard and Enterprise EditionThe Base Board: TEBF0818-02A
The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081xMPSoC series.
Key Features
- Mini-ITX form factor, PC enclosure compatible
- ATX-24 power supply connector
- Optional 12V standard power plug
- Headers
- Intel 10-pin HDA audio
- Intel 9-pin power/reset button, Power-/HD-LED
- PC-BEEPER
- On-board power-/reset-switches
- 2 x configuration 4-bit DIP switches
- 2 x optional 4-wire PWM fan connectors
- PCIe slot - one PCIe lane (16 lane connector)
- CAN FD transceiver (10 Pin IDC connector and 6-pin header)
- 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 xMicrochip 24AA025E48T-I/OT)
- Dual SFP+ connector (2x1 Cage)
- 1 x DisplayPort (single lane)
- 1 x SATA connector
- 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
- 1 x USB 3.0 on-board connector with two ports
- FMC HPC slot (FMC_VADJ max. VCCIO)
- FMC fan
- Gigabit Ethernet RGMII PHY with RJ45 MagJack
- All carrier board peripherals' IC interfaces muxed to MPSoC's IC interface
- Quad programmable PLL clock generator
- 2 x SMA coaxial connectors for clock signals
- MicroSD/MMC card socket (bootable)
- 64 GBit (8 GByte) on-board eMMC Flash
- 2 x System controller CPLDs Lattice MachXO2 1200 HC
- 1 x Samtec FireFly (4 GT lanes bidirectional)
- 1 x Samtec FireFly connector for reverse loopback
- 20-pin ARM JTAG connector (PS JTAG0)
- 3 x Pmod connector (GPIO's and IC interface to SC CPLDs and MPSoC module)
- On-board DC-DC PowerSoCs
- Size: 170 mm 170 mm.Please download the assembly diagram for exact details.
- Mating height with standard connectors: 5 mm
PC Enclosure Accessible I/O
- PCIe
- FMC
- Dual SFP+
- RJ45 Gigabit Ethernet
- 2 x USB3 Host
- Displayport
- microSD
- Two LEDs
- CAN FD (using DB9 to IDC10 Cable)
Core V1 Mini-ITX Enclosure - Technical Features
- Dimensions: 260 x 276 x 316 mm (B x H x T)
- Material: Steel
- Colour: Black
- Drive Slots: 2 x 3.5 inch (intern, 3.5 inch) and 2 x 2.5 inch (intern, 2.5 inch)
- Expansion slots: 2
- I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
- Maximum graphic card lenght: 255 mm (inner enclosure)
- Maximum graphic card lenght: 285 mm (outer enclosure)
- Maximum CPU cooler height: 140 mm
- Maximum lenght power supply: 200 mm
Scope of Delivery - Starter Kit
- 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
- 1 x Power supply Be quiet! BN292 Be Quiet! Pure Power 11, 400W, 80 PLUS (with fan)
- 1 x TE0813-02-3BE81-A MPSoC module with AMD Zynq UltraScale+ ZU3EG
- 1 x TEBF0818-02A base board
- 1 xHeatsink SuperGrip ATS-X50230B-C1-R0 23 x 23 x 7,5 mm (Article no. 29665)
- 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
- 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
- 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
- 1 x USB cable, Type A to Type B Mini, 2 meter length
- 1 x power cable Schuko 1.8m black
- 4x Phillips screws, M3 x 6, pan head, zinc coated
Additional Information
- Manufacturer's article number: TE0813-02-3BE81-AS
- Trenz Electronic TE0813 Starter Kit Wiki
- Support Forum
All modules produced by Trenz Electronicare developed and manufactured in Germany.
Caractéristique technique | Valeur |
---|---|
ID de l’art. | 103205 |
État | |
ID de l'ancien article | 01967b9f098372b698ccc1d827b72c01 |
Modèle | TE0813-02-3BE81-AS |
Fabricant | |
Pays de fabrication | Allemagne |
Contenu | 1 pièce |
Poids | 6300 g |