BGA Heat Sink - High Performance maxiFLOW/superGRIP - Low Profile
Heat Sink Type: maxiFLOW
Heat Sink Attachment: superGRIP
Features
- Designed for23 x23 mm components
- Requires minimal space around the components perimeter; ideal for densely populated PCBs
- Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
- Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs
- Eliminates the need to drill mounting holes in the PCB
Thermal Performance
Product Detail
Dimension A: 23.00 mm
Dimension B: 23.00 mm
Dimension C: 7.50 mm
Dimension D: 37.5 mm
TIM: T766
Finish: Blue-Anodized
- Dimension A and B refer to component size
- Dimension C is the heat sink height from the bottom of the base to the top of the fin field
- Thermal performance data are provided for reference only. Actual performance may vary by application
- ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant
Manufacturer: ATS Advanced Thermal Solutions, Inc.
Manufacturer's article number: ATS Part#: ATS-X50230B-C1-R0
Trenz Electronic GmbH
Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803 and TE0813 (29665)
High Performance maxiFLOW/superGRIP Heat Sink, 23 x 23 x 7,5 mm, BGA Aluminium, top mounting
Référence de l’article: VAR-827003504
Numéro de produit du fabricant: 29665
Code douane: 84715000
Niveau de stock: 0
Niveau de stock: plus de 100
Niveau de stock: ${ $store.getters.currentItemVariation.stock.net }
L'article est expédié depuis Riedlingen, en Allemagne.
* Hors TVA hors Frais de livraison
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