Alinx Electronic Limited

Alinx AXU9EGB Dev Board & Kit with AMD Zynq US+ MPSoC ZU9EG

The AXU9EGB development board equipped with the AMD Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with DDR4 SDRAM, eMMC Flash, QSPI Flash, SFP+, PCIe, FMC HPC, M.2, DP, CAN/RS485, suitable for Artificial Intelligence, Computing, Automotive, Industrial, Video, and Communication, etc.


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ID articolo 102408
Condizione
Modello AXU9EGB V2.1
Produttore Alinx Electronic Limited
Paese di produzione
Numero della tariffa doganale 8471800000

Numero di variazione (MEPA): VAR-827002848

Codice produttore: AXU9EGB V2.1

Codice doganale: 8471800000


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Importazione espressa due volte alla settimana dalle scorte di fabbrica, consegna immediata con sdoganamento effettuato con fattura conforme alle norme UE.

Il prodotto viene spedito da Riedlingen, Germania.


1.337,36 EUR *
Contenuto 1
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* IVA Excl. escl. Costi di spedizione

AXU9EGB Development Board & Kit with AMD Zynq™ UltraScale+ MPSoC XCZU9EG ZU9EG

Product Description

The AXU9EGB/15EGB development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, FMC HPC, DP, M.2.


Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provide high-speed communication (SFP+), high-speed storage (M.2) and video applications (DP).

Applications

  • ● Artificial Intelligence

    ● Automotive

    ● AV Broadcasting

  • ● Deep learning

    ● Digital Signal Processing

    ● 5G Wireless and Wire Communication

  • ● Data Centers

    ● Drive / Motion Control

    ● Industrial Internet of Thing

  • ● Cloud Computing Security

    ● Machine Vision

  • ● Medical Endoscop

    ● Video and Image Processing



Key Features

  • System-on-Module

    ● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
    ◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz
    ◆ ARM® dual-core Cortex™-R5F up to 533 MHz
    ◆ Mali-400 MP2 GPU
    ◆ 16nm FinFET+ FPGA fabric
    ● Pluggable module with 4 x Panasonic board-to-board connectors
    ● 4 GByte (64-bit) DDR4 SDRAM on PS
    ● 2 GByte (32-bit) DDR4 SDRAM on PL
    ● 64 MB QSPI Flash
    ● 32 GB eMMC Flash
  • Base Board

    ● 1 x FMC HPC Connector (36 pairs lvds ios + 8 pairs GTH)
    ● 2 x SFP+ Slots (per line 12.5Gbps)
    ● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
    ● 2 x UART (1 x PS + 1 x PL)(USB to UART)
    ● 1 x M.2 Interface on PS
    ● 1 x DP Interface on PS
    ● 1 x 2 lane MIPI on PL
    ● 2 x CAN on PS
    ● 2 x RS485 Interfaces (1 x PS + 1 x PL)
    ● 2 x USB3.0 on PS + 2 x USB2.0 on PS
    ● 1x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
    ● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75)
    ● 1 x Micro SD
    ● 1 x RTC (Real-time clock)
    ● LED (1 x pwr + 1 x done + 1 x PL) + KEY (1 x RST + 1 x PS + 1 x PL)
    ● 12V single supply
    ● Dimensions: 180 x 135 mm form factor

Ceres::Template.singleItemTechnicalDataAttribute Ceres::Template.singleItemTechnicalDataValue
ID articolo 102408
Condizione
Modello AXU9EGB V2.1
Produttore Alinx Electronic Limited
Paese di produzione
Contenuto 1 undefined
Peso 1800 g
Peso netto 1500 g

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ MPSoC XCZU9EG-2FFVB1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ MPSoC based application.

AXU9EGB Development Board & Kit with AMD Zynq™ UltraScale+ MPSoC XCZU9EG ZU9EG

* The AXU9EGB development board consists of a ACU9EG SOM and base board. If you want to purchase ACU9EG SOM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU9EG development board and Some accessories

The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

System-on-Module1Base Board1
Heatsink Kit (preinstalled)1USB Downloader Cable / set1
12V Power Adapter1Acrylic board1
Mini USB Cable1Card Reader1
TF Card1