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Trenz Electronic GmbH
MPSoC Module with AMD Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm (TE0821-02-3BE81MA)
AMD/Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 8 GByte e.MMC Speicher, Pin-kompatibel mit TE0820, size: 4 x 5 cm
Item number VAR-827003075
Manufacturer Product Number: TE0821-02-3BE81MA
Taric/custom code: 84718090
Available for immediate dispatch: 0
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 20 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 427.53
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Content
1 piece
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The predecessor of this article is TE0821-01-3BE21MA. All changes are in the Product Change Notification (PCN).
Technical characteristic | Value |
---|---|
Item ID | 102623 |
Condition | New |
Legacy item ID | 3903 |
Model | TE0821-02-3BE81MA |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 68 g |
Net weight | 68 g |
Customs tariff number | 84718090 |
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EUR 225.87 *
* Excl. VAT
excl.
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Item bundle
[Bundle] Reliable network connectivity in a limited 3D system space
EUR 207.36 *
* Excl. VAT
excl.
Shipping
chipKIT zUNO Clip: Mechanical Mount for Microcontroller Boards
EUR 7.27 *
* Excl. VAT
excl.
Shipping
SoC Module with Xilinx Zynq 7020-1C, 1 GByte DDR3, 8 GByte e.MMC, 4 x 5 cm (TE0720-04-61C33MA)
EUR 225.87 *
* Excl. VAT
excl.
Shipping
Item bundle
[Bundle] Reliable network connectivity in a limited 3D system space
EUR 207.36 *
* Excl. VAT
excl.
Shipping
chipKIT zUNO Clip: Mechanical Mount for Microcontroller Boards
EUR 7.27 *
* Excl. VAT
excl.
Shipping
SoC Module with Xilinx Zynq 7020-1C, 1 GByte DDR3, 8 GByte e.MMC, 4 x 5 cm (TE0720-04-61C33MA)
EUR 225.87 *
* Excl. VAT
excl.
Shipping
Item bundle
[Bundle] Reliable network connectivity in a limited 3D system space
EUR 207.36 *
* Excl. VAT
excl.
Shipping