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AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 13,179.65 *
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Heat Sink for Trenz Electronic Modules TE0820/TE0821, spring-loaded embedded (33338)
Please check assembly instructions! Made especially for modules from the TE0820/TE0821 series
Item number VAR-827003501
Manufacturer Product Number: 33338
Taric/custom code: 84718000
Available for immediate dispatch: 0
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 20 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 24.79
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Content
1 piece
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Please check assembly instructions!
Features
- Made especially for modules from theTE0820/TE0821 series
- Material: aluminium
- Spring-loaded embedded
- Weight: 60 g
Scope of Delivery
- 1 x heat sink
- 1 x thermal pad
- 4 x pressure springs
- 2x spacers 0.5 mm black
- 2 xspacers bolt2 mm blue
- 4 x screws
Additional Information
Technical characteristic | Value |
---|---|
Item ID | 103015 |
Condition | New |
Legacy item ID | 01967b9ed33b731f97284f031d71bfad |
Model | 33338 |
Manufacturer | |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 109 g |
Customs tariff number | 84718000 |
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 13,179.65 *
* Excl. VAT
excl.
Shipping
Item bundle
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 13,179.65 *
* Excl. VAT
excl.
Shipping
Item bundle
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 13,179.65 *
* Excl. VAT
excl.
Shipping
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excl.
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