Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05 (33013)

Please check assembly instructions!

Wakefield-Vette's 27 x 27 x 23mm Pin Fin heat sink uses natural convection and thermal resistance of 9.44 C/Watt.

The heatsink is mounted on the chipset.

Features

• Heat sink with modified clip for precise fit on TE0741 (Revision 04/05)
• Heat dissipation material: aluminum
• Shape: Square, Pin Fins
• Fin type: elliptical pin
• Size: 27 x 27mm
• Height from base (height of pins): 22.65 mm
• Material Finish: Black Anodized
• Weight per piece: ca. 18 g
• Mounting method: Clip mounting

Scope of Delivery

• 1 x Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 and 05
• 1 x Heat conduction pad 25 x 25 mm

Additional Information

• Manufacturer: Wakefield-Vette
• Manufacturer's part number: 904-27-2-23-2-B-0
• Download Data SheetPin Fin Heat Sink
• Download Assembly Instructions
• Overview modules TE0741 series
• Trenz Electronic Wiki for 30313 heatsink
• Trenz Electronic Wiki Cooling Solutions Overview
• Support Forum