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MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
EUR 303.33 *
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Trenz Electronic GmbH
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
Item number VAR-827001099
Manufacturer Product Number: TE0803-04-3BE11-A
Taric/custom code: 84715000
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
EUR 427.53
*
Content
1 piece
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| Technical characteristic | Value |
|---|---|
| Item ID | 100897 |
| Condition | New |
| Legacy item ID | 3247 |
| Model | TE0803-04-3BE11-A |
| Manufacturer | Trenz Electronic GmbH |
| Manufacturing country | Germany |
| Content | 1 piece |
| Weight | 67 g |
| Net weight | 67 g |
| Customs tariff number | 84715000 |
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
EUR 303.33 *
* Excl. VAT
excl.
Shipping
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
EUR 303.33 *
* Excl. VAT
excl.
Shipping
MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm(TE0813-02-5DE81-A)
EUR 1,128.32 *
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BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 32.27 *
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MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm(TE0813-02-5DE81-A)
EUR 1,128.32 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 32.27 *
* Excl. VAT
excl.
Shipping
