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Alinx BZ10 Dev Board & Kit with AMD Zynqâ„¢ US+ MPSoC XCZU7EV

The ALINX BZ10 is a high-performance Zynq UltraScale+ MPSoC (XCZU7EV) development platform featuring 4GB DDR4, 32GB eMMC, quad FMC-HPC interfaces, 40Gbps QSFP+, USB 3.1, DisplayPort, and PCIe M.2 for accelerated computing in AI, industrial vision, 5G, and automotive systems


Item number VAR-827003381

Manufacturer Product Number: BZ10

Taric/custom code:


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Ready for dispatch. In stock

Item located in and dispatched from: Riedlingen, Germany


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Content 1 piece


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Product Description

The BZ10 development board, equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC (XCZU7EV), delivers high-performance capabilities including 4GB DDR4 SDRAM (2400Mbps), 32GB eMMC Flash, and 512Mb QSPI Flash. It features extensive interfaces: 4× FMC HPC connectors , PCIe Gen2×1 via M.2 (5Gbps for SSD storage), DisplayPort (4K@30Hz video output), QSFP+ fiber optic (40Gbps), USB 3.0 Type-C, Gigabit Ethernet, and Micro SD support.


 

Applications

  • ● Artificial Intelligence

    ● Automotive

    ● AV Broadcasting

  • ● Deep learning

    ● Digital Signal Processing

    ● 5G Wireless and Wire Communication

  • ● Data Centers

    ● Drive / Motion Control

    ● Industrial Internet of Things

  • ● Cloud Computing Security

    ● Machine Vision

  • ● Medical Endoscopy

    ● Hardware Security Acceleration



Key Features

  • ● AMD/Xilinx Zynqâ„¢ Ultrascale+â„¢ MPSoC ZU7EV :
    ◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz
    ◆ ARM® dual-core Cortex™-R5F up to 533 MHz
    â—† Mali-400 MP2 GPU
    â—† H.264 / H.265 Video Codec
    â—† 16nm FinFET+ FPGA fabric
    ● 4 GByte (64-bit) DDR4 SDRAM on PS
    ● 64 MB QSPI Flash
    ● 32 GB eMMC Flash
  • ● 4 x FMC HPC
    ● 1 x Display Port (4K 30Hz/1080P 60Hz video)
    ● 1 x 40G QSFP+
    ● 1 x NVMe M.2 (PCIE Gen2 x1)
    ● 1 x PS Gigabit Ethernet
    ● 1 x USB 3.0 Type-C
    ● 1 x UART (USB to UART)
    ● 1 x JTAG
    ● 1 x EEPROM 24LC04
    ● 1 x Micro SD
    ● LED (1 x pwr + 1 x done + 2 x USER) + KEY (1 x RST)
    ● 12V single supply
    ● Dimensions: 385 x 155 mm form factor

What's Inside the Box

ALINX AMD Xilinx Zynqâ„¢ UltraScale+â„¢ MPSoC XCZU7EV development board and Some accessories

The  Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

Development Board1Heatsink Kit (preinstalled)1
12V Power Adapter1TF Card1
Mini USB Cable1Card Reader1
USB Downloader Cable / set1  


Technical characteristic Value
Item ID 102897
Condition New
Legacy item ID
Model BZ10
Manufacturer
Manufacturing country Germany
Content 1 piece
Weight 1000 g
Customs tariff number

Development Board Features

Featuring the AMD/Xilinx's Zynqâ„¢ UltraScale+â„¢ MPSoC XCZU7EV-2FFVC1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynqâ„¢ UltraScale+â„¢ MPSoC based application.

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