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Alinx AXW22 Dev Board with AMD Zynqâ„¢ US+ RFSoC XCZU47DR

The AXW22 development board integrates AMD Zynq UltraScale+ XCZU47DR RFSoC with ​2-channel 14-bit 5.0GSPS ADCs​ and ​2-channel 14-bit 9.85GSPS DACs​ for direct RF sampling, combining programmable logic, multi-core ARM processing, and high-speed interfaces (40G QSFP+/10G SFP+) to enable heterogeneous signal processing in radar, 5G, and software-defined radio applications.


Item number VAR-827003378

Manufacturer Product Number: AXW22

Taric/custom code:


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Item located in and dispatched from: Riedlingen, Germany


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Product Description

The AXW22 development board adopts the Zynq UltraScale+ RFSoC Gen3 series XCZU47DR FPGA chip, integrating RF direct sampling data converters, FPGA logic, a multi-core ARM processor subsystem (Quad Cortex-A53 + Dual Cortex-R5), and high-speed transceivers. It supports 2-channel 14-bit RF-ADCs at 5.0 GSPS and 2-channel 14-bit RF-DACs at 9.85GSPS. The board maximizes I/O channel density and bandwidth while enabling heterogeneous processing with optimized power efficiency for RF signal chains.


The AXW22 development board supports prototyping and development for large-scale MIMO systems, 5G baseband processing, fixed wireless access (FWA), DOCSIS 3.x cable access, RF testing and measurement, satellite communication systems, phased array radar (prototyping), and digital array radar systems, alongside other high-performance RF applications

Applications

  • ● 5G FR1 RF and baseband prototyping

  • ● Phased array radar signal processing (subsystem)

  • ● Digital radar signal processing

  • ● software radio

  • ● Wideband spectrum sensing



Key Features

  • ● AMD/Xilinx Zynqâ„¢ Ultrascale+â„¢ RFSoC:
    ◆ ARM® quad-core Cortex™-A53 up to 1.333GHz
    ◆ ARM® dual-core Cortex™-R5F up to 533MHz
    â—† 16nm FinFET+ FPGA fabric           
    ● 4 GByte (64-bit) DDR4 SDRAM on PS
    ● 2 GByte (32-bit) DDR4 SDRAM on PL
    ● 256 MB QSPI Flash
    ● 1x 40G QSFP+fiber optic
    ● 1x 10G SFP+ fiber optic
    ● Gigabit Ethernet Interface
    ● 1x GPS RF Input Port
  • ● RF SMBs
    â—† 2 x 14bit RF-ADC @ 5.0 GSPS
    â—† 2 x 14bit RF-DAC @ 9.85 GSPS
    ● 1x JTAG
    ● 36x GPIOs 
    ● 1x SD Card
     â— 1x RS232
    ● 1x SPI
    ● 1x  I2C EEPROM
    ● 8x LED
    ● 12V single supply
    ● Dimensions: 180 x 135 mm form factor

What's Inside the Box

ALINX AMD Xilinx Zynqâ„¢ UltraScale+â„¢ RFSoC ZU47DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

Development Board1Heatsink Kit (preinstalled)1
SMA cable1Network cable1
SD card1The power adapter1
Data USB flash drive1  


Technical characteristic Value
Item ID 102894
Condition New
Legacy item ID
Model AXW22
Manufacturer
Manufacturing country Germany
Content 1 piece
Weight 1000 g
Customs tariff number

Development Board Features

Featuring the AMD/Xilinx's Zynqâ„¢ UltraScale+â„¢ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynqâ„¢ UltraScale+â„¢ RFSoC based application.

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